Cabinet System
Optimized for high-density networking. Streamline your rack power infrastructure with our flexible, space-saving design.
Network Rack
Product Introduction
Aesthetic & Engineering Excellence: Sophisticated, elegant design featuring precision-engineered dimensions and high-quality craftsmanship.
Robust Structural Integrity: The frame is constructed from high-strength 9-fold profile steel with welded, reinforced mounting nuts, ensuring exceptional load-bearing stability.
Standardized Mounting: Compliant with the 19-inch EIA-310 standard. Offers fully adjustable mounting depth and vertical U-spacing (rack units) to accommodate diverse equipment configurations.
Advanced Access & Security: Features single-panel hexagonal mesh front doors and dual-panel hexagonal mesh rear doors. Equipped with high-security locks, supporting a wide-angle door swing of up to 120 degrees for effortless maintenance.
Optimized Airflow: Engineered for high-performance cooling with a ventilation rate exceeding 71%, effectively managing heat dissipation for high-density deployments.
Flexible Cable Management: The top panel is pre-configured with multiple cable entry points. A modular three-piece bottom plate allows for customizable cable routing to suit various facility layout requirements.
Modular Side Panels: Three-piece removable side panels, enabling independent access to each section for streamlined serviceability.
Generous Mounting Width: Provides a clear internal mounting width of 487mm (19.17 inches), offering superior compatibility with a wide range of rack-mount equipment.
Mobility & Stability: Equipped with heavy-duty, versatile casters and adjustable leveling feet, allowing for seamless transition between mobile and fixed, stabilized configurations.
① Top Cover ② Profile Frame ③ Front Door ④ Side Panel ⑤ Left Rear Door ⑥ Right Rear Door ⑦ Swing Handle Lock ⑧ Mounting Rail ⑨ Square-Hole Rail ⑩ Bottom Panel ⑪ 2 in. Threaded Casters
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Get your custom solution:
We need basic information to design custom liquid cooling system:
- Please specify the quantity, technical specifications, and physical dimensions of your IT equipment (servers, ICT systems, etc.), alongside the power distribution requirements per individual device or rack.
- Please provide a high-level summary of your project and its primary drivers. Are you prioritizing peak performance, water conservation, energy optimization, heat recovery, or extreme compute density?
- Please specify your preferred liquid cooling methodology—whether it be Direct-to-Chip (Cold Plate) or Immersion Cooling. Additionally, outline your intended strategy for heat rejection or thermal energy recovery.
- Please provide the planned country and city location. This allows us to factor in local climate data for precise heat transfer analysis and generate accurate shipping estimates.