Liquid-Cooled Edge Data Center

Liquid-Cooled

Edge Data Center

Product Introduction

The ANP Series liquid-cooled edge data centers feature ultra-high computing density. Leveraging high-speed interconnect technology, they maintain microsecond-level communication latency to achieve efficient inter-node data transmission, effectively enhancing both data processing efficiency and energy utilization. This represents a crucial development direction for future data centers.

Standardizing liquid cooling technology for supernode data centers drives the high-quality and sustainable development of the data center industry. As a highly efficient thermal management solution, liquid cooling effectively lowers the operating temperatures of data centers, improving equipment stability and extending service life. Concurrently, it reduces energy consumption, aligning perfectly with the trend toward green and low-carbon development.

TECHNICAL CAPABILITIES

Scalable liquid cooling

driving density and expansion.

These offerings are tailored for vendors transitioning to liquid cooling technologies, as well as for clients seeking to evaluate or design a scalable roadmap utilizing a dependable and field-tested solution.

Semiconductor R&D

We collaborate with leading chipmakers to evaluate, benchmark, and co-engineer advanced thermal solutions, spanning from forced convection to precision liquid cooling and cutting-edge heat transfer technologies.

Holistic System Tuning

Empowering IT vendors to smoothly transition from air to liquid cooling. We deliver expert consulting, architectural design guidance, and rigorous reliability testing to ensure enduring peak performance.

Integrated Infrastructure Testing

Validating performance from the rack level to large-scale pods, we partner with leading OEMs and ODMs to deliver production-ready, easily deployable liquid cooling solutions.

Large-Scale Architecture Planning

We co-develop reference architectures to ensure seamless liquid cooling scalability across entire clusters, fully integrating networking, storage, and management infrastructure.

Coolant Chemical Analysis

From assessing material compatibility to fluid performance testing and recycling, our specialized chemistry labs guarantee that the coolants driving your data center achieve peak efficiency and environmental sustainability.

Empowering Component Partners

We work alongside component manufacturers to tailor structured cabling, power distribution, and networking hardware for high-density liquid cooling setups—featuring specialized advancements such as our proprietary Operations Cart.

TECHNOLOGY

State-of-the-art

Advanced Liquid Cooling Centers

IT From components to full-rack integration, we collaborate with you and your preferred vendors to maximize workload efficiency. Thermal End-to-end heat management — from chip-level dissipation to full-stack cooling infrastructure Mechanical engineering Server validation and optimization in liquid cooling environments. System validation Quick-prototyping capabilities to validate your ideas in record time. Chemistry From TCS loop optimization to immersion fluid development, our chemical engineering team brings over a decade of expertise in liquid cooling.

INDUSTRY BENEFITS

Always ahead.

Proven by performance

Future roadmap insights

Anticipating industry trends and providing you with early access to critical developments across the value chain.

Warranty enablement

Establishing warranty structures for bespoke, end-to-end solutions and new technologies.

Strategic industry connections

Connecting you with hyperscale, silicon, IT and fluid providers so you can access future-proof solutions.

From ideas to production

NEXUS partners with hyperscalers, IT manufacturers, and fluid specialists to bridge the gap between breakthrough designs and large-scale industrial deployment.

Get in Touch

Our team provides expert guidance and unwavering support; we believe the best ideas should always be shared

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Get your custom solution:

We need basic information to design custom liquid cooling system:

Please specify the quantity, technical specifications, and physical dimensions of your IT equipment (servers, ICT systems, etc.), alongside the power distribution requirements per individual device or rack.
Please provide a high-level summary of your project and its primary drivers. Are you prioritizing peak performance, water conservation, energy optimization, heat recovery, or extreme compute density?
Please specify your preferred liquid cooling methodology—whether it be Direct-to-Chip (Cold Plate) or Immersion Cooling. Additionally, outline your intended strategy for heat rejection or thermal energy recovery.
Please provide the planned country and city location. This allows us to factor in local climate data for precise heat transfer analysis and generate accurate shipping estimates.